Princeton University

School of Engineering & Applied Science

Self-Assembled Porous Silica Low-k Films for Interconnects

Prof. Takamaro Kikkawa
E-Quad B205
Friday, September 19, 2014 - 1:30pm

Abstract:    Self-assembled mesoporous silica low-k films were developed for Cu Damascene interconnects in large scale integrated circuits. A silylation vapour anneal technology using 1,3,5,7-tetramethylcyclotetrasiloxane (TMCTS) was developed to enhance the elastic modulus of the mesoporous film by cross-linking TMCTS molecules. It was found that cesium doping in the mesoporous silica as a catalyst improved the elastic modulus of siloxane networks.
Biography:  Takamaro Kikkawa received the B.S. and M.S. degrees in electronic engineering from Shizuoka University, Shizuoka, Japan, and the Ph.D. degree in electronic system from Tokyo Institute of Technology, Tokyo, Japan. He joined NEC Corporation, Tokyo, Japan, where he conducted the research and development on the interconnect technologies for logic ULSI and DRAM. He was a Visiting Scientist at MIT under Prof. D. A. Antoniadis. He is currently Professor of the Graduate School of Advanced Sciences of Matter and Director of the Research Institute for Nanodevice and Bio Systems, Hiroshima University, Hiroshima, Japan. He is Councilor of Hiroshima University. His research interests are wireless and wired CMOS integrated circuits and radar-based breast cancer detection technology. He is Fellow of the IEEE and Fellow of Japan Society of Applied Physics.